areas of application
Hightech & Semiconductor Equipment
Precision manufacturing for next-generation equipment
Semiconductor equipment requires exceptional precision, thermal stability and reliability. As systems become more compact and power densities increase, thermal management is becoming one of the key design challenges.
EB-PBF enables complex cooling geometries and integrated functionality in high-performance metals that are difficult to manufacture conventionally. This creates opportunities for improved thermal control and more compact system designs.
Typical applications include thermal management solutions, precision machine components, engine parts and complex cooling structures for high-tech manufacturing systems.
Featured project
Conformal cooling block
Modern semiconductor equipment generates significant thermal loads that directly influence process stability and productivity. Conventional manufacturing limits the design of internal cooling channels.
EB-PBF enables fully integrated cooling channels following the optimal heat flow path, resulting in more efficient heat removal, reduced thermal gradients and improved temperature stability.
Research focuses on thermal optimization, flow modelling, manufacturability and performance validation.
